Wafer Thickness Measurement System - MPT1000

OEM Products

Laser based Wafer Thickness and Roughness Measurement System designed by Chapman Instrument Inc., USA and OEM by QES Mechatronic Sdn Bhd. A non-contact measurement system measures several parameters in a single system. (wafer & tape thickness, roughness, TTV, bump height, bow and warp measurements)

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Key Features

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• Thickness resolution (0.1um) providing uniform TTV for production control of wafers.

• Measurements after back grind or dicing provides flexibility for thickness uniformity control.

• Small focused laser spot (1 um) provides the resolution required for measuring bumped wafers and via features.